XCVU9P-2FSGD2104E Overview
In the package 2104-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. This device features 676 I/Os in order to transfer data in a more efficient manner. The basic building blocks of logic contain 2586150 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order to operate it, it requires a voltage supply of 0.825V~0.876V . As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. As a space-saving measure, this FPGA model is contained within Tray. This device is equipped with 391168000 RAM bits in terms of its RAM si391168000e. A total of 147780 LABs/CLBs are included in this FPGA.
XCVU9P-2FSGD2104E Features
676 I/Os
Up to 391168000 RAM bits
XCVU9P-2FSGD2104E Applications
There are a lot of Xilinx Inc. XCVU9P-2FSGD2104E FPGAs applications.
- Aerospace and Defense
- Medical Applications
- Ecosystem
- Software-defined radios
- Security systems
- ASIC prototyping
- Medical ultrasounds
- Video & Image Processing
- Integrating multiple SPLDs
- Telecommunication
