XCVU3P-3FFVC1517E Overview
This package is included in the 1517-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Having 520 I/Os makes data transfers more coherent. In order to construct a fundamental building block, 862050 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. The operating temperature should be kept at 0°C~100°C TJ when operating. It is for space saving reasons that this FPGA model is contained in Tray. There are 118067200 RAM bits that are available with this device. A total of 49260 LABs/CLBs make up this FPGA array.
XCVU3P-3FFVC1517E Features
520 I/Os
Up to 118067200 RAM bits
XCVU3P-3FFVC1517E Applications
There are a lot of Xilinx Inc. XCVU3P-3FFVC1517E FPGAs applications.
- DO-254
- Electronic Warfare
- Wired Communications
- Defense Applications
- ADAS
- Wireless Communications
- Development Boards and Shields for Microcontrollers
- Automotive
- Software-defined radios
- Broadcast
