XCVU3P-2FFVC1517I Overview
There are two packages that contain fpga chips: 1517-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 520 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 862050 logic elements or cells. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 118067200. A total of 49260 LABs/CLBs make up this FPGA array.
XCVU3P-2FFVC1517I Features
520 I/Os
Up to 118067200 RAM bits
XCVU3P-2FFVC1517I Applications
There are a lot of Xilinx Inc. XCVU3P-2FFVC1517I FPGAs applications.
- Cryptography
- Military DSP
- Server Applications
- Broadcast
- Medical Electronics
- Data Center
- Wireless Communications
- Voice recognition
- High Performance Computing
- Bioinformatics
