XCVU33P-2FSVH2104E Overview
There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 208 I/Os are available for transferring data more efficiently. A fundamental building block consists of 961800 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 0.825V~0.876V battery. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. As far as the RAM bits are concerned, this device offers you a total of 24746394. Fpga electronics contains 54960 LABs/CLBs in an array.
XCVU33P-2FSVH2104E Features
208 I/Os
Up to 24746394 RAM bits
XCVU33P-2FSVH2104E Applications
There are a lot of Xilinx Inc. XCVU33P-2FSVH2104E FPGAs applications.
- Automotive Applications
- Industrial,Medical and Scientific Instruments
- Data Center
- Broadcast
- Medical Electronics
- Defense Applications
- Software-defined radios
- Radar and Sensors
- Medical ultrasounds
- Scientific Instruments
