XCVU27P-2FSGA2577I Overview
A 2577-BBGA, FCBGA package is provided with this component. 448 I/Os are available for transferring data more efficiently. A fundamental building block consists of 2835000 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.825V~0.876V battery. This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. As far as the RAM bits are concerned, this device offers you a total of 74344038. A total of 162000 LABs/CLBs make up this FPGA array.
XCVU27P-2FSGA2577I Features
448 I/Os
Up to 74344038 RAM bits
XCVU27P-2FSGA2577I Applications
There are a lot of Xilinx Inc. XCVU27P-2FSGA2577I FPGAs applications.
- Image processing
- Bioinformatics
- Aircraft navigation
- Industrial IoT
- Voice recognition
- Industrial,Medical and Scientific Instruments
- Integrating multiple SPLDs
- Solar Energy
- Data center hardware accelerators
- Telecommunication
