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XCVU13P-3FIGD2104E

XCVU13P-3FIGD2104E

XCVU13P-3FIGD2104E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU13P-3FIGD2104E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Published 2013
Series Virtex® UltraScale+™
Part StatusActive
HTS Code8542.39.00.01
Voltage - Supply 0.873V~0.927V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 676
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of LABs/CLBs 216000
RoHS StatusROHS3 Compliant
In-Stock:39 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XCVU13P-3FIGD2104E Product Details

XCVU13P-3FIGD2104E Overview


As part of the 2104-BBGA, FCBGA package, it is included. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 676 I/Os for better data transfer. To form a fundamental building block, there are 3780000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates wFpga chipsh a supply voltage of 0.873V~0.927V. The FPGA belongs to the Virtex? UltraScale+? series of FPGAs, and it is one type of FPGA. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. This device is equipped with 514867200 RAM bits in terms of its RAM si514867200e. Fpga electronics contains 216000 LABs/CLBs in an array.

XCVU13P-3FIGD2104E Features


676 I/Os
Up to 514867200 RAM bits

XCVU13P-3FIGD2104E Applications


There are a lot of Xilinx Inc. XCVU13P-3FIGD2104E FPGAs applications.

  • Secure Communication
  • Automotive
  • Consumer Electronics
  • Wireless Communications
  • Broadcast
  • Artificial intelligence (AI)
  • Filtering and communication encoding
  • Enterprise networking
  • Space Applications
  • Medical imaging

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