XCVU13P-3FHGA2104E Overview
The package that contains this software is called 2104-BBGA, FCBGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 832 I/Os are programmed to ensure a more coherent data transfer. There are 3780000 logic elements/cells to form a fundamental building block. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order for it to operate, the supply voltage must be 0.873V~0.927V . It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 514867200 bfpga electronics s of RAM. The FPGA consists of 216000 LABs/CLBs.
XCVU13P-3FHGA2104E Features
832 I/Os
Up to 514867200 RAM bits
XCVU13P-3FHGA2104E Applications
There are a lot of Xilinx Inc. XCVU13P-3FHGA2104E FPGAs applications.
- Enterprise networking
- Space Applications
- Scientific Instruments
- Automotive driver's assistance
- OpenCL
- Wireless Communications
- Development Boards and Shields for Microcontrollers
- Telecommunication
- Voice recognition
- Camera time adjustments
