XCVU13P-2FIGD2104E Overview
Fpga chips is supplied in the 2104-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 676 I/Os for transferring data in a more coherent manner. There are 3780000 logic elements/cells to form a fundamental building block. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 514867200 bFpga chipss. 216000 LABs/CLBs are configured on this FPGA.
XCVU13P-2FIGD2104E Features
676 I/Os
Up to 514867200 RAM bits
XCVU13P-2FIGD2104E Applications
There are a lot of Xilinx Inc. XCVU13P-2FIGD2104E FPGAs applications.
- Voice recognition
- Data Mining
- Automation
- Solar Energy
- ADAS
- Image processing
- Secure Communication
- Integrating multiple SPLDs
- Space Applications
- Medical Applications
