XCVU13P-1FIGD2104E Overview
There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 3780000 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. The operating temperature should be kept at 0°C~100°C TJ when operating. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 514867200 bFpga chipss. 216000 LABs/CLBs are integrated into this FPGA.
XCVU13P-1FIGD2104E Features
676 I/Os
Up to 514867200 RAM bits
XCVU13P-1FIGD2104E Applications
There are a lot of Xilinx Inc. XCVU13P-1FIGD2104E FPGAs applications.
- Audio
- Industrial IoT
- Artificial intelligence (AI)
- Defense Applications
- Video & Image Processing
- Camera time adjustments
- Wired Communications
- Industrial,Medical and Scientific Instruments
- Automotive Applications
- Aerospace and Defense
