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XCVU11P-2FLGB2104E

XCVU11P-2FLGB2104E

XCVU11P-2FLGB2104E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU11P-2FLGB2104E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Series Virtex® UltraScale+™
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 572
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2835000
Total RAM Bits 396150400
Number of LABs/CLBs 162000
RoHS StatusROHS3 Compliant
In-Stock:45 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XCVU11P-2FLGB2104E Product Details

XCVU11P-2FLGB2104E Overview


A 2104-BBGA, FCBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 572 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 2835000 logic elements/cells are required. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.825V~0.876V battery. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 396150400 bfpga electronics s of RAM. A total of 162000 LABs/CLBs make up this FPGA array.

XCVU11P-2FLGB2104E Features


572 I/Os
Up to 396150400 RAM bits

XCVU11P-2FLGB2104E Applications


There are a lot of Xilinx Inc. XCVU11P-2FLGB2104E FPGAs applications.

  • Industrial,Medical and Scientific Instruments
  • Cryptography
  • Device controllers
  • Voice recognition
  • Aerospace and Defense
  • Digital signal processing
  • Data center hardware accelerators
  • Electronic Warfare
  • ASIC prototyping
  • Military DSP

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