XCVU11P-2FLGA2577E Overview
There is a 2577-BBGA, FCBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 448 I/Os for transferring data in a more coherent manner. Logic elements/cells form the fundamental building block of a computer. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. As far as the RAM bits are concerned, this device offers you a total of 396150400. An array of 162000 LABs/CLBs is built into the FPGA.
XCVU11P-2FLGA2577E Features
448 I/Os
Up to 396150400 RAM bits
XCVU11P-2FLGA2577E Applications
There are a lot of Xilinx Inc. XCVU11P-2FLGA2577E FPGAs applications.
- Random logic
- Automotive Applications
- Military Temperature
- Automotive advanced driver assistance systems (ADAS)
- Software-defined radios
- Development Boards and Shields for Microcontrollers
- Consumer Electronics
- Solar Energy
- Artificial intelligence (AI)
- Video & Image Processing