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XCVU080-2FFVB1760E

XCVU080-2FFVB1760E

XCVU080-2FFVB1760E

Xilinx Inc.

FPGAs Virtex? UltraScale? Series 1760-BBGA, FCBGA

SOT-23

XCVU080-2FFVB1760E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Operating Temperature0°C~100°C TJ
PackagingBulk
Published 2012
Series Virtex® UltraScale™
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 0.922V~0.979V
Number of I/O 702
Number of Logic Elements/Cells 975000
Total RAM Bits 51200000
Number of LABs/CLBs 55714
RoHS StatusROHS3 Compliant
In-Stock:1540 items

XCVU080-2FFVB1760E Product Details

XCVU080-2FFVB1760E Overview


A 1760-BBGA, FCBGA package is provided with this component. Its 702 I/Os help it transfer data more efficiently. There are 975000 logic elements/cells to form a fundamental building block. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order for it to operate, the supply voltage must be 0.922V~0.979V . There are many types of FPGAs in the Virtex? UltraScale? series, this is one of them. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. A model of this FPGA is contained in Bulk for the purpose of saving space. The RAM bits that this device offer is 51200000. 55714 LABs/CLBs are integrated into this FPGA. There is a device package provided by 1760-FCBGA (42.5x42.5) as its supplier.

XCVU080-2FFVB1760E Features


702 I/Os
Up to 51200000 RAM bits

XCVU080-2FFVB1760E Applications


There are a lot of Xilinx Inc. XCVU080-2FFVB1760E FPGAs applications.

  • Random logic
  • Distributed Monetary Systems
  • Medical Electronics
  • Broadcast
  • Wireless Communications
  • Military Temperature
  • Integrating multiple SPLDs
  • Data center search engines
  • Wired Communications
  • Data Mining

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