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XCV300-4FG456I

XCV300-4FG456I

XCV300-4FG456I

Xilinx Inc.

2.5V V 2.6mm mm FPGAs Virtex? Series 456-BBGA 1mm mm 456

SOT-23

XCV300-4FG456I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 456-BBGA
Number of Pins 456
Operating Temperature-40°C~100°C TJ
PackagingTray
Published 2002
Series Virtex®
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 456
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XCV300
Pin Count456
Number of Outputs 312
Operating Supply Voltage2.5V
Number of I/O 312
RAM Size 8kB
Clock Frequency 250MHz
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 6912
Total RAM Bits 65536
Number of Gates322970
Number of LABs/CLBs 1536
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.8 ns
Height Seated (Max) 2.6mm
Length 23mm
Width 23mm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:2430 items

XCV300-4FG456I Product Details

XCV300-4FG456I Overview


There is a 456-BBGA package that includes this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Fpga chips is programmed wFpga chipsh 312 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 6912 logic elements/cells. An electrical supply voltage of 2.5V powers it. An FPGA part from the Field Programmable Gate Arrays family. Using a Surface Mount connector, you can mount this FPGA module on the development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. As part of the Virtex? series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. A total of 312 outputs are incorporated into this device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, there are a total of 456 terminations on fpga chips. A device like this one offers 65536 RAM bits, which is a considerable amount of memory. XCV300 is the base part number that can be used to identify related parts. The RAM si8kBe of this FPGA module reaches 8kB to ensure normal operation of the program. There are 456 pins on this device. 1536 LABs/CLBs are integrated into this FPGA. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Design engineers can fully take advantage of its flexibility when operating at 2.5V supply voltage. Fpga semiconductor is made up of 322970 gates as fpga semiconductors basic building block. Featuring 456 pins in total, it is a versatile device. Typically, it uses a crystal oscillating at 250MHz in order to operate.

XCV300-4FG456I Features


312 I/Os
Up to 65536 RAM bits
456 LABs/CLBs

XCV300-4FG456I Applications


There are a lot of Xilinx Inc. XCV300-4FG456I FPGAs applications.

  • Enterprise networking
  • Embedded Vision
  • Automotive driver's assistance
  • Space Applications
  • Wireless Communications
  • Bioinformatics
  • Medical Applications
  • OpenCL
  • Industrial IoT
  • Distributed Monetary Systems

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