XCKU9P-1FFVE900I Overview
There are two packages that contain fpga chips: 900-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 304 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 599550 logic elements or cells. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. As part of the Kintex? UltraScale+? series of FPGAs, it is a type of FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. As a space-saving measure, this FPGA model is contained within Bulk. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 41881600 bFpga chipss. A total of 34260 LABs/CLBs make up this FPGA array.
XCKU9P-1FFVE900I Features
304 I/Os
Up to 41881600 RAM bits
XCKU9P-1FFVE900I Applications
There are a lot of Xilinx Inc. XCKU9P-1FFVE900I FPGAs applications.
- Defense Applications
- Military Temperature
- Telecommunication
- Medical ultrasounds
- Development Boards and Shields for Microcontrollers
- Bioinformatics
- Integrating multiple SPLDs
- Medical Applications
- Data center search engines
- Industrial,Medical and Scientific Instruments
