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XCKU5P-2FFVB676I

XCKU5P-2FFVB676I

XCKU5P-2FFVB676I

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 676-BBGA, FCBGA

SOT-23

XCKU5P-2FFVB676I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Published 2012
Series Kintex® UltraScale+™
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 280
RAM Size 2.1MB
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 474600
Total RAM Bits 41984000
Number of LABs/CLBs 27120
RoHS StatusROHS3 Compliant
In-Stock:49 items

Pricing & Ordering

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XCKU5P-2FFVB676I Product Details

XCKU5P-2FFVB676I Overview


Fpga chips is supplied in the 676-BBGA, FCBGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A total of 280 I/Os are programmed to ensure a more coherent data transfer. In order to construct a fundamental building block, 474600 logic elements/cells are required. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . The Kintex? UltraScale+? Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that this device offer is 41984000. It is crucial that the RAM si2.1MBe of this FPGA module reaches 2.1MB so that the program can run normally. The FPGA is built as an array of 27120 latches or CLBs.

XCKU5P-2FFVB676I Features


280 I/Os
Up to 41984000 RAM bits

XCKU5P-2FFVB676I Applications


There are a lot of Xilinx Inc. XCKU5P-2FFVB676I FPGAs applications.

  • Bioinformatics
  • Software-defined radio
  • Scientific Instruments
  • Consumer Electronics
  • High Performance Computing
  • Artificial intelligence (AI)
  • Radar and Sensors
  • Random logic
  • Distributed Monetary Systems
  • Broadcast

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