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XCKU5P-1SFVB784I

XCKU5P-1SFVB784I

XCKU5P-1SFVB784I

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 784-BBGA, FCBGA

SOT-23

XCKU5P-1SFVB784I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 784-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Kintex® UltraScale+™
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 304
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 474600
Total RAM Bits 41984000
Number of LABs/CLBs 27120
RoHS StatusROHS3 Compliant
In-Stock:35 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XCKU5P-1SFVB784I Product Details

XCKU5P-1SFVB784I Overview


As part of the 784-BBGA, FCBGA package, it is included. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 304 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 474600 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.825V~0.876V battery. As part of the Kintex? UltraScale+? series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. In order to save space, this FPGA model has been contained in Tray. Having a RAM bit size of 41984000 means that this device will offer you a lot of memory. Fpga electronics contains 27120 LABs/CLBs in an array.

XCKU5P-1SFVB784I Features


304 I/Os
Up to 41984000 RAM bits

XCKU5P-1SFVB784I Applications


There are a lot of Xilinx Inc. XCKU5P-1SFVB784I FPGAs applications.

  • Automotive
  • Integrating multiple SPLDs
  • Wireless Communications
  • Bioinformatics
  • Automation
  • Military Temperature
  • Medical Applications
  • Embedded Vision
  • ASIC prototyping
  • Data center hardware accelerators

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