XCKU115-3FLVF1924E Overview
There are two packages that contain fpga chips: 1924-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 728 I/Os for better data transfer. A fundamental building block consists of 1451100 logic elements/cells. Power is provided by a 1V-volt supply. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 0.970V~1.030V battery. The Kintex? UltraScale? Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at 0°C~100°C TJ when operating. This device is equipped with 728 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Bulk in order to conserve space. Fpga electronics is worth mentioning that this device provides 77721600 bfpga electronics s of RAM. The RAM si9.5MBe of this FPGA module reaches 9.5MB to ensure normal operation of the program. 82920 LABs/CLBs are configured on this FPGA. This is a battery operated device that operates on 1V. Its architecture is based on 5520 CLBs. It uses a packing method TRAY, which is suitable for most industrial design purposes.
XCKU115-3FLVF1924E Features
728 I/Os
Up to 77721600 RAM bits
XCKU115-3FLVF1924E Applications
There are a lot of Xilinx Inc. XCKU115-3FLVF1924E FPGAs applications.
- Enterprise networking
- Scientific Instruments
- Device controllers
- Defense Applications
- Security systems
- Automation
- Integrating multiple SPLDs
- Image processing
- Distributed Monetary Systems
- Secure Communication
