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XCKU040-2FBVA676E

XCKU040-2FBVA676E

XCKU040-2FBVA676E

Xilinx Inc.

2.71mm mm FPGAs Kintex? UltraScale? Series 676-BBGA, FCBGA 1mm mm 676

SOT-23

XCKU040-2FBVA676E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Published 2012
Series Kintex® UltraScale™
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 312
Qualification StatusNot Qualified
Power Supplies0.95V
Number of I/O 312
RAM Size 2.6MB
Number of Inputs 312
Organization 1920 CLBS
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 530250
Total RAM Bits 21606000
Number of LABs/CLBs 30300
Number of CLBs 1920
Height Seated (Max) 2.71mm
Length 27mm
Width 27mm
RoHS StatusROHS3 Compliant
In-Stock:37 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XCKU040-2FBVA676E Product Details

XCKU040-2FBVA676E Overview


This package is included in the 676-BBGA, FCBGA package and is available for purchase. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 530250 logic elements/cells. In order to operate fpga chips, a voltage supply of 0.95V volts is required. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. Powered by a 0.922V~0.979V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA belonging to the Kintex? UltraScale? seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. During the installation of this device, 312 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 676 terminations. A device like this one offers 21606000 RAM bits, which is a considerable amount of memory. During the configuration of this FPGA module, the RAM si2.6MBe reaches 2.6MB to ensure that the program runs normally. The FPGA is built as an array of 30300 latches or CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. It is powered by a 0.95V battery, which can be purchased separately. In order to make the architecture work, 1920 CLBs are used.

XCKU040-2FBVA676E Features


312 I/Os
Up to 21606000 RAM bits

XCKU040-2FBVA676E Applications


There are a lot of Xilinx Inc. XCKU040-2FBVA676E FPGAs applications.

  • Image processing
  • Automotive
  • Data Center
  • Industrial,Medical and Scientific Instruments
  • Defense Applications
  • Aircraft navigation
  • Military DSP
  • Solar Energy
  • Security systems
  • Military Temperature

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