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XC7Z035-2FFV676E

XC7Z035-2FFV676E

XC7Z035-2FFV676E

Xilinx Inc.

0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O

SOT-23

XC7Z035-2FFV676E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Operating Temperature0°C~100°C TJ
PackagingBulk
Series Zynq®-7000
Published 2010
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of I/O 130
Speed 800MHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
RoHS StatusROHS3 Compliant
In-Stock:3944 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XC7Z035-2FFV676E Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 275K Logic Cells.Housed in the state-of-art Bulk package.130 I/Os in total are included in this SoC part.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XC7Z035-2FFV676E System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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