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XC7Z035-2FFG900I

XC7Z035-2FFG900I

XC7Z035-2FFG900I

Xilinx Inc.

900 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

SOT-23

XC7Z035-2FFG900I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact PlatingCopper, Silver, Tin
Mount Surface Mount
Package / Case 900-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage1.05V
Min Supply Voltage950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay100 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 2
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800
Length 31mm
Height Seated (Max) 3.35mm
Width 31mm
RoHS StatusROHS3 Compliant
In-Stock:44 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XC7Z035-2FFG900I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 275K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There are 900 terminations in total and that really benefits system on a chip.The wireless SoC works at a frequency of 800MHz.The SoC meaning is based on the core architecture of ARM.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.It is rated with 1.05V maximum supply voltage.It is supplied with at least 950mV power.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z035-2FFG900I System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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