This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.95V.Having 676 terminations in total makes system on a chip possible.667MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.The SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY, which are additional features.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-1FFG676C System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
