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XC7Z030-L2FBG676I

XC7Z030-L2FBG676I

XC7Z030-L2FBG676I

Xilinx Inc.

676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

SOT-23

XC7Z030-L2FBG676I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact PlatingCopper, Silver, Tin
Mount Surface Mount
Package / Case 676-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage1.05V
Min Supply Voltage950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Number of Registers 157200
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Length 27mm
Height Seated (Max) 2.54mm
Width 27mm
RoHS StatusROHS3 Compliant
In-Stock:49 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$399.10000$399.1

XC7Z030-L2FBG676I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In total, there are 676 terminations, which is great for system on a chip.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This power supply is rated with a maximum voltage of 1.05V.Power is supplied to it at least in the amount of 950mV.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z030-L2FBG676I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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