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XC3S5000-5FG900C

XC3S5000-5FG900C

XC3S5000-5FG900C

Xilinx Inc.

1.2V V 2.6mm mm FPGAs Spartan?-3 Series 900-BBGA 1mm mm 900

SOT-23

XC3S5000-5FG900C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 900-BBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingBulk
Published 2009
Series Spartan®-3
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch1mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) 30
Pin Count900
JESD-30 Code S-PBGA-B900
Number of Outputs 633
Qualification StatusNot Qualified
Operating Supply Voltage1.2V
Number of I/O 633
RAM Size 234kB
Number of Inputs 633
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of Gates5000000
Number of LABs/CLBs 8320
Speed Grade 5
Height Seated (Max) 2.6mm
Length 31mm
Width 31mm
RoHS StatusNon-RoHS Compliant
In-Stock:50 items

Pricing & Ordering

QuantityUnit PriceExt. Price
27$238.00074$6426.01998

XC3S5000-5FG900C Product Details

XC3S5000-5FG900C Overview


As part of the 900-BBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 633 I/Os for better data transfer. In order to construct a fundamental building block, 74880 logic elements/cells are required. Power is provided by a 1.2V-volt supply. There is a Field Programmable Gate Arrays family component in this FPGA part. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. This is a type of FPGA that is part of the Spartan?-3 series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. The device has 633 outputs that are integrated into it. A model of this FPGA is contained in Bulk for the purpose of saving space. Fpga chips is designed wFpga chipsh 900 terminations. There are 1916928 RAM bits that are available with this device. There is a maximum RAM si234kBe of 234kB on this FPGA module, which is necessary to ensure the normal operation of the program. A total of 8320 LABs/CLBs are included in this FPGA. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. The building block that forms the basis of the system contains 5000000 gates. A total of 900 pins are included in this device.

XC3S5000-5FG900C Features


633 I/Os
Up to 1916928 RAM bits

XC3S5000-5FG900C Applications


There are a lot of Xilinx Inc. XC3S5000-5FG900C FPGAs applications.

  • OpenCL
  • Audio
  • ADAS
  • Aerospace and Defense
  • Development Boards and Shields for Microcontrollers
  • Wireless Communications
  • Medical Applications
  • Enterprise networking
  • Industrial Ethernet
  • Electronic Warfare

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