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XC2S50-6PQG208C

XC2S50-6PQG208C

XC2S50-6PQG208C

Xilinx Inc.

2.5V V 4.1mm mm FPGAs Spartan?-II Series 208-BFQFP 0.5mm mm 208

SOT-23

XC2S50-6PQG208C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 208-BFQFP
Number of Pins 208
Operating Temperature0°C~85°C TJ
PackagingTray
Published 2008
Series Spartan®-II
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 2.375V~2.625V
Terminal Position QUAD
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 245
Supply Voltage 2.5V
Terminal Pitch0.5mm
[email protected] Reflow Temperature-Max (s) 30
Pin Count208
Number of Outputs 176
Qualification StatusNot Qualified
Operating Supply Voltage2.5V
Number of I/O 140
RAM Size 4kB
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1728
Total RAM Bits 32768
Number of Gates50000
Number of LABs/CLBs 384
Speed Grade 6
Number of CLBs 384
Height Seated (Max) 4.1mm
Length 28mm
Width 28mm
RoHS StatusROHS3 Compliant
In-Stock:2504 items

Pricing & Ordering

QuantityUnit PriceExt. Price
48$21.98000$1055.04

XC2S50-6PQG208C Product Details

XC2S50-6PQG208C Overview


In the package 208-BFQFP, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 140 I/Os are programmed to ensure a more coherent data transfer. There are 1728 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. Field Programmable Gate Arrays family FPGA part. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. FPGAs belonging to the Spartan?-II series are a type of FPGA that belong to the Spartan?-II series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. A total of 176 outputs are incorporated into this device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 208 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 32768 bFpga chipss. For the program to work properly, the RAM si4kBe of this FPGA module must reach 4kB GB in order to ensure normal operation. This cable has 208 pins and is designed to connect to a computer. 384 LABs/CLBs are configured on this FPGA. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. In the case of 2.5V supply voltage, designers can take full advantage of its flexibility. Fpga semiconductor is made up of 50000 gates as fpga semiconductors basic building block. This device has a pin count of 208 in fpga semiconductor. In order to make the architecture work, 384 CLBs are used.

XC2S50-6PQG208C Features


140 I/Os
Up to 32768 RAM bits
208 LABs/CLBs

XC2S50-6PQG208C Applications


There are a lot of Xilinx Inc. XC2S50-6PQG208C FPGAs applications.

  • ASIC prototyping
  • Device controllers
  • Cryptography
  • Space Applications
  • Medical ultrasounds
  • Medical Applications
  • Data Mining
  • High Performance Computing
  • ADAS
  • Data Center

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