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XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

Xilinx Inc.

484 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V

SOT-23

XAZU3EG-1SBVA484Q Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Package / Case 484-BFBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~125°C TJ
PackagingTray
Series Zynq® UltraScale+™ MPSoC EG
Part StatusActive
Number of Terminations 484
HTS Code8542.31.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.8MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Length 19mm
Height Seated (Max) 2.61mm
Width 19mm
RoHS StatusROHS3 Compliant
In-Stock:51 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$976.62000$976.62
500$966.8538$483426.9
1000$957.0876$957087.6
1500$947.3214$1420982.1
2000$937.5552$1875110.4
2500$927.789$2319472.5

XAZU3EG-1SBVA484Q Product Details

This SoC is built on Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ core processor(s).


A Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-BFBGA, FCBGA package.With 1.8MB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MPU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~125°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.128 I/Os in total are included in this SoC part.It is advised to utilize a 0.85V power supply.There are 484 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU3EG-1SBVA484Q System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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