XA7S75-2FGGA484I Overview
There are two packages that contain fpga chips: 484-BGA package and X package. Fpga chips is programmed wFpga chipsh 338 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 12000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. This device is powered by a 0.95V~1.05V battery. There are many types of FPGAs in the Automotive, AEC-Q100, Spartan?-7 XA series, this is one of them. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. Having a RAM bit size of 3317760 means that this device will offer you a lot of memory. 6000 LABs/CLBs are configured on this FPGA.
XA7S75-2FGGA484I Features
338 I/Os
Up to 3317760 RAM bits
XA7S75-2FGGA484I Applications
There are a lot of Xilinx Inc. XA7S75-2FGGA484I FPGAs applications.
- Wireless Communications
- Server Applications
- ADAS
- Industrial Ethernet
- Military Temperature
- Data Mining
- Space Applications
- High Performance Computing
- Defense Applications
- Broadcast
