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XCV150-4FGG456C

XCV150-4FGG456C

XCV150-4FGG456C

Xilinx

2.5V V 2.6mm mm FPGAs FBGA 1mm mm 456

SOT-23

XCV150-4FGG456C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case FBGA
Surface MountYES
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 456
ECCN Code EAR99
Max Operating Temperature85°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 2.5V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count456
Operating Supply Voltage2.5V
Supply Voltage-Max (Vsup) 2.625V
Temperature GradeOTHER
RAM Size 6kB
Clock Frequency 250MHz
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.8 ns
Number of CLBs 864
Length 23mm
Height Seated (Max) 2.6mm
Width 23mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:3957 items

XCV150-4FGG456C Product Details

XCV150-4FGG456C Overview


In the package FBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Supply voltage is 2.5V volts. In total, the terminations of this piece are 456. The RAM si6kBe of this FPGA module reaches 6kB so as to guarantee the normal operation of the program during operation. In operation with 2.5V, designers can take advantage of its flexibility to the fullest extent. This module can reach a maximum operating temperature of 85°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. I am going to present you with a device that is equipped with 456 pins. Fpga semiconductor typically uses a crystal oscillating at 250MHz. The architecture of the system is based on 864 CLBs.

XCV150-4FGG456C Features


85°C gates


XCV150-4FGG456C Applications


There are a lot of Xilinx
XCV150-4FGG456C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center

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