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XCR3512XL-10FGG324C

XCR3512XL-10FGG324C

XCR3512XL-10FGG324C

Xilinx

1mm PMIC 324 Pin 3.3V FBGA

SOT-23

XCR3512XL-10FGG324C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Package / Case FBGA
Number of Pins 324
Published 1996
JESD-609 Code e1
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature70°C
Min Operating Temperature 0°C
Additional FeatureYES
HTS Code8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 3.3V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count324
Qualification StatusNot Qualified
Operating Supply Voltage3.3V
Supply Voltage-Max (Vsup) 3.6V
Temperature GradeCOMMERCIAL
Number of I/O 260
Memory TypeEEPROM
Propagation Delay10 ns
Frequency (Max) 97MHz
Programmable Logic TypeEE PLD
Number of Gates12000
Number of Logic Blocks (LABs) 32
Speed Grade 10
Output FunctionMACROCELL
Number of Macro Cells 512
JTAG BST YES
In-System Programmable YES
Length 23mm
Height Seated (Max) 2.5mm
Width 23mm
RoHS StatusRoHS Compliant
In-Stock:2887 items

XCR3512XL-10FGG324C Product Details

XCR3512XL-10FGG324C Overview


The mobile phone network has 512 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).In the FBGA package, you will find it.In this case, there are 260 I/Os programmed.324 terminations are programmed into the device.This electrical component has a terminal position of BOTTOM.An electrical supply voltage of 3.3V is used to power it.The part belongs to Programmable Logic Devices family.A chip with 324 pins is programmed.This device also displays YES.A digital circuit can be constructed using 12000 gates.In order to achieve high efficiency, the supply voltage should be maintained at 3.3V.In this case, EEPROM will be used to store the data.Surface Mount is the mounting point of this electronic part.The device has a pinout of 324.There is a maximum supply voltage (Vsup) of 3.6V.Operating temperatures should be higher than 0°C.Ideally, the operating temperature should be below 70°C.There are 32 logic blocks (LABs) that make up its basic building block.It should be below 97MHz at the maximal frequency.Programmable logic types are divided into EE PLD.

XCR3512XL-10FGG324C Features


FBGA package
260 I/Os
324 pin count
324 pins
32 logic blocks (LABs)


XCR3512XL-10FGG324C Applications


There are a lot of Xilinx
XCR3512XL-10FGG324C CPLDs applications.


  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems
  • Portable digital devices
  • Handheld digital devices
  • Battery operated portable devices
  • Complex programmable logic devices

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