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XCR3384XL-10FGG324I

XCR3384XL-10FGG324I

XCR3384XL-10FGG324I

Xilinx

1mm PMIC 3.3V FBGA

SOT-23

XCR3384XL-10FGG324I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Surface MountYES
Package / Case FBGA
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Additional FeatureYES
HTS Code8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 3.3V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count324
Operating Supply Voltage3.3V
Supply Voltage-Max (Vsup) 3.6V
Temperature GradeINDUSTRIAL
Number of I/O 220
Memory TypeEEPROM
Propagation Delay10 ns
Frequency (Max) 102MHz
Organization 0 DEDICATED INPUTS, 220 I/O
Programmable Logic TypeEE PLD
Number of Logic Blocks (LABs) 24
Speed Grade 10
Output FunctionMACROCELL
Number of Macro Cells 384
JTAG BST YES
In-System Programmable YES
Width 23mm
Height Seated (Max) 2.5mm
Length 23mm
RoHS StatusRoHS Compliant
Radiation HardeningNo
In-Stock:3382 items

XCR3384XL-10FGG324I Product Details

XCR3384XL-10FGG324I Overview


There are 384 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).It is embedded in the FBGA package.It is programmed with 220 I/Os.There are 324 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.It is powered from a supply voltage of 3.3V.This part is included in Programmable Logic Devices.It is equipped with 324 pin count.It is also characterized by YES.The supply voltage should be maintained at 3.3V for high efficiency.EEPROM is adopted for storing data.The maximal supply voltage (Vsup) reaches 3.6V.The operating temperature should be higher than -40°C.The operating temperature should be lower than 85°C.Its basic building block is composed of 24 logic blocks (LABs).The maximal frequency should be lower than 102MHz.This kind of FPGA is composed of EE PLD.

XCR3384XL-10FGG324I Features


FBGA package
220 I/Os
324 pin count
24 logic blocks (LABs)


XCR3384XL-10FGG324I Applications


There are a lot of Xilinx
XCR3384XL-10FGG324I CPLDs applications.


  • Power up sequencing
  • Voltage level translation
  • Timing control
  • Interface bridging
  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems

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