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XC7Z045-2FF676E

XC7Z045-2FF676E

XC7Z045-2FF676E

Xilinx

FPGAs 800MHz MHz FCBGA 676

SOT-23

XC7Z045-2FF676E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Package / Case FCBGA
Surface MountYES
Published 2010
Pbfree Code no
Number of Terminations 676
Max Operating Temperature100°C
Min Operating Temperature 0°C
Additional FeatureGPIO WITH FOUR 32-BIT BANKS
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Frequency 800MHz
JESD-30 Code S-PBGA-B676
Temperature GradeOTHER
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
Peripherals DMA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Bus Compatibility CAN, ETHERNET, I2C, PCI, SPI, UART, USB
RoHS StatusNon-RoHS Compliant
In-Stock:2570 items

XC7Z045-2FF676E Product Details

XC7Z045-2FF676E Overview


A FCBGA package contains it, and it is available for download. Its 130 I/Os help it transfer data more efficiently. In total, there are a total of 676 terminations on fpga chips. A maximum operating temperature of 100°C can be reached by this module. Over 0°C should be the operating temperature. A frequency of 800MHz provides high efficiency. The GPIO WITH FOUR 32-BIT BANKS feature also characterizes fpga circuit. The FPGA incorporates the ARM core architecture to provide a complete solution to the development of Telemedicine-capable devices.

XC7Z045-2FF676E Features


130 I/Os
100°C gates
Operating from a frequency of 800MHz


XC7Z045-2FF676E Applications


There are a lot of Xilinx
XC7Z045-2FF676E FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems

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