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XC7A200T-3FB484E

XC7A200T-3FB484E

XC7A200T-3FB484E

Xilinx

1V V FPGAs FCBGA

SOT-23

XC7A200T-3FB484E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case FCBGA
Max Operating Temperature100°C
Min Operating Temperature 0°C
Operating Supply Voltage1V
Number of I/O 285
RAM Size 1.6MB
Propagation Delay110 ps
Number of Logic Elements/Cells 215360
Number of Logic Blocks (LABs) 16825
Speed Grade 3
Number of Registers 269200
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:3159 items

XC7A200T-3FB484E Product Details

XC7A200T-3FB484E Overview


There are two packages that contain fpga chips: FCBGA package and X package. Having 285 I/Os makes data transfers more coherent. Logic blocks consist of 215360 logic elements/cells. This FPGA module has a RAM si1.6MBe of 1.6MB that is sufficient to make sure that the program is able to run normally. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. The 1V supply voltage provides designers with full flexibility in their designs. During its maximal operating temperature, this module reaches 100°C. In order to achieve 0°C, the operating temperature must be higher than 0°C. Fpga semiconductor consists of 16825 logic blocks (LABs). The data is stored and transferred using 269200 registers that are used for this purpose.

XC7A200T-3FB484E Features


285 I/Os
100°C gates
16825 logic blocks (LABs)
269200 registers


XC7A200T-3FB484E Applications


There are a lot of Xilinx
XC7A200T-3FB484E FPGAs applications.


  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics

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