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XC3S2000-4FGG900I

XC3S2000-4FGG900I

XC3S2000-4FGG900I

Xilinx

1.2V V FPGAs FBGA 900

SOT-23

XC3S2000-4FGG900I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Package / Case FBGA
Number of Pins 900
Published 2005
JESD-609 Code e1
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Max Operating Temperature100°C
Min Operating Temperature -40°C
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count900
Number of Outputs 565
Qualification StatusNot Qualified
Operating Supply Voltage1.2V
Power Supplies1.21.2/3.32.5V
Max Supply Voltage1.26V
Min Supply Voltage1.14V
Number of I/O 565
RAM Size 90kB
Clock Frequency 630MHz
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 46080
Number of Gates2e+06
Number of Logic Blocks (LABs) 5120
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.61 ns
Number of Equivalent Gates 2000000
Height 1.75mm
Length 31mm
Width 31mm
RoHS StatusRoHS Compliant
In-Stock:2236 items

XC3S2000-4FGG900I Product Details

XC3S2000-4FGG900I Overview


This package is included in the FBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. With this device, you will be able to make use of 565 outputs. The total number of terminations is 900. During the configuration of this FPGA module, the RAM si90kBe reaches 90kB to ensure that the program runs normally. The device is designed with 900 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. It is powered by a 1.21.2/3.32.5V battery, which can be purchased separately. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 2e+06 gates as fpga semiconductors basic building block. The device has a total of 900 pins on fpga semiconductor. In its basic building block, it is composed of 5120 logic blocks (LABs), which are called building blocks. A crystal oscillating at 630MHz is one of the most common components of this device. In addfpga semiconductorion, fpga semiconductor is able to support a maximum supply voltage of 1.26V. The unit is capable of working with a minimum supply voltage of 1.14V. There are 2000000 equivalent gates in the FPGA that implement the design.

XC3S2000-4FGG900I Features


565 I/Os
900 LABs/CLBs
100°C gates
5120 logic blocks (LABs)


XC3S2000-4FGG900I Applications


There are a lot of Xilinx
XC3S2000-4FGG900I FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio

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