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W632GG8AB-12

W632GG8AB-12

W632GG8AB-12

Winbond Electronics

Memory IC

SOT-23

W632GG8AB-12 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 78-TFBGA
Operating Temperature0°C~95°C TC
PackagingTray
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology SDRAM - DDR3
Voltage - Supply 1.425V~1.575V
Memory Size2Gb 128M x 16
Memory TypeVolatile
Clock Frequency 800MHz
Access Time 20ns
Memory Format DRAM
Memory InterfaceParallel
RoHS StatusROHS3 Compliant
In-Stock:4432 items

Pricing & Ordering

QuantityUnit PriceExt. Price

W632GG8AB-12 Product Details

W632GG8AB-12 Overview


As far as its memory type goes, it falls into the Volatile category. Tray-cases are available. Embedded in the 78-TFBGA case, memory ics is a single file. A memory chip with a capacity of 2Gb 128M x 16 is used on this device. In this device, the memory is of the DRAM-format, which is a popular format in the mainstream computing sector. Featuring an extended operating temperature range of 0°C~95°C TC, this device allows it to be used in a variety of demanding applications. It is capable of handling a voltage supply of 1.425V~1.575V. The recommended mounting type for memory ics is Surface Mount. During the rotation of the clock, the ic memory chip is set as 800MHz.

W632GG8AB-12 Features


Package / Case: 78-TFBGA

W632GG8AB-12 Applications


There are a lot of Winbond Electronics W632GG8AB-12 Memory applications.

  • eSRAM
  • personal digital assistants
  • networking
  • personal computers
  • hard disk drive (HDD)
  • DVD disk buffer
  • cell phones
  • workstations,
  • embedded logic
  • data buffer

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