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W632GG8AB-11

W632GG8AB-11

W632GG8AB-11

Winbond Electronics

Memory IC

SOT-23

W632GG8AB-11 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 78-TFBGA
Operating Temperature0°C~95°C TC
PackagingTray
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology SDRAM - DDR3
Voltage - Supply 1.425V~1.575V
Memory Size2Gb 128M x 16
Memory TypeVolatile
Clock Frequency 933MHz
Access Time 20ns
Memory Format DRAM
Memory InterfaceParallel
RoHS StatusROHS3 Compliant
In-Stock:3288 items

Pricing & Ordering

QuantityUnit PriceExt. Price

W632GG8AB-11 Product Details

W632GG8AB-11 Overview


In this case, the memory type of the device can be classified as Volatile. Tray-cases are available. 78-TFBGA case encloses it. On the chip, there is an 2Gb 128M x 16 memory, which is the size of the chip's memory. The device uses a mainstream DRAM-format memory. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. The device is capable of handling a supply voltage of 1.425V~1.575V. There is a recommended mounting type of Surface Mount for it. It has a clock frequency of 933MHz.

W632GG8AB-11 Features


Package / Case: 78-TFBGA

W632GG8AB-11 Applications


There are a lot of Winbond Electronics W632GG8AB-11 Memory applications.

  • hard disk drive (HDD)
  • main computer memory
  • networks
  • eSRAM
  • telecommunications
  • cell phones
  • graphics card
  • supercomputers
  • DVD disk buffer
  • printers

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