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W25Q64FVZPIM

W25Q64FVZPIM

W25Q64FVZPIM

Winbond Electronics

SpiFlash? Memory IC SpiFlash? Series

SOT-23

W25Q64FVZPIM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (6x5)
Operating Temperature-40°C~85°C TA
PackagingTray
Series SpiFlash®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Memory Size64Mb 8M x 8
Memory TypeNon-Volatile
Clock Frequency 104MHz
Memory Format FLASH
Memory InterfaceSPI - Quad I/O, QPI
Write Cycle Time - Word, Page 50μs, 3ms
RoHS StatusROHS3 Compliant
In-Stock:1234 items

W25Q64FVZPIM Product Details

W25Q64FVZPIM Overview


Its memory type can be classified as Non-Volatile. There is a Tray case available. The 8-WDFN Exposed Pad case contains it. It is estimated that the memory size on the chip is 64Mb 8M x 8. This device utilizes a FLASH format memory which is of mainstream design. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V volts. The recommended mounting type for memory ics is Surface Mount. In this memory, the clock frequency rotation is within an 104MHz range. This part plays an important role in applications that target the SpiFlash? series of memory devices.

W25Q64FVZPIM Features


Package / Case: 8-WDFN Exposed Pad

W25Q64FVZPIM Applications


There are a lot of Winbond Electronics W25Q64FVZPIM Memory applications.

  • personal digital assistants
  • networking
  • workstations,
  • eDRAM
  • Cache memory
  • mainframes
  • Camcorders
  • main computer memory
  • multimedia computers
  • printers

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