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1843820000

1843820000

1843820000

Weidmüller

Conn Board to Board SKT 9 POS 5.08mm Solder RA Thru-Hole Box

SOT-23

1843820000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Contact MaterialCopper Alloy
Mount Through Hole
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature-50°C~100°C
PackagingBulk
Series Omnimate BL
Feature Mating Flange, Retention Latches
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Header, Female Sockets
Color Orange
Gender Female
Voltage - Rated 300V
Pitch 0.200 5.08mm
Insulation Height 0.405 10.29mm
Current Rating16A
Termination Style Solder
Contact Tail Length 0.126 3.20mm
Number of Levels 1
Number of Poles 9
Contact Mating Finish Tin
Voltage - UL 300V
Current - UL 15A
Voltage - IEC 400V
Header Orientation 90°, Right Angle
Current - IEC 23A
Hole Diameter 1.3 mm
Material Flammability Rating UL94 V-0
Radiation HardeningNo
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:1469 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$4.29460$214.73

About 1843820000

The 1843820000 from Weidmüller is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Board to Board SKT 9 POS 5.08mm Solder RA Thru-Hole Box.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1843820000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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