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624-25ABT4E

624-25ABT4E

624-25ABT4E

Wakefield-Vette

HEATSINK CPU 21MM SQ W/DBL TAPE

SOT-23

624-25ABT4E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Adhesive
Material Aluminum
Weight 4.09g
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
PackagingBulk
Published 2008
Series 624
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Color Black
Construction FIN
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.250 6.35mm
Thermal Resistance @ Forced Air Flow 25.00°C/W @ 200 LFM
Natural Thermal Resistance 25 °C/W
Profile PIN FIN ARRAY
Fin Orientation OMNIDIRECT
Height 6.4mm
Length 0.827 21.00mm
Width 0.827 21.00mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:3242 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.94000$1.94
10$1.88700$18.87
25$1.83600$45.9
50$1.73420$86.71
100$1.63220$163.22
250$1.53016$382.54
500$1.47914$739.57

About 624-25ABT4E

The 624-25ABT4E from Wakefield-Vette is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEATSINK CPU 21MM SQ W/DBL TAPE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 624-25ABT4E, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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