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WSLP0603R0330FEK

WSLP0603R0330FEK

WSLP0603R0330FEK

Vishay Dale

Res Metal Strip 0603 33m Ohm 1% 2/5W 75ppm/C Molded SMD Bulk

SOT-23

WSLP0603R0330FEK Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 44 Weeks
Mount Surface Mount
Package / Case 0603 (1608 Metric)
Supplier Device Package 0603
Operating Temperature-65°C~170°C
PackagingBulk
Published 2016
Series WSLP
Size / Dimension 0.060Lx0.030W 1.52mmx0.76mm
Tolerance ±1%
Feature Anti-Sulfur, Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Wraparound
Temperature Coefficient±75ppm/°C
Resistance 33mOhms
Max Operating Temperature170°C
Min Operating Temperature -65°C
Composition Metal Element
Power (Watts) 0.4W 2/5W
Power Rating 400mW
Height Seated (Max) 0.023 0.58mm
Length 1.52mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:9461 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.94000$0.94
500$0.9306$465.3
1000$0.9212$921.2
1500$0.9118$1367.7
2000$0.9024$1804.8
2500$0.893$2232.5

About WSLP0603R0330FEK

The WSLP0603R0330FEK from Vishay Dale is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Metal Strip 0603 33m Ohm 1% 2/5W 75ppm/C Molded SMD Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the WSLP0603R0330FEK, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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