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RNC55H2051FRRE765

RNC55H2051FRRE765

RNC55H2051FRRE765

Vishay Dale

Res Metal Film 2.05K Ohm 1% 1/8W 50ppm/C 0.01% Conformal AXL Thru-Hole T/R

SOT-23

RNC55H2051FRRE765 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Contact PlatingLead, Tin
Mount Through Hole
Package / Case Axial
Supplier Device Package Axial
Operating Temperature-65°C~175°C
PackagingTape & Reel (TR)
Series Military, MIL-PRF-55182/01, RNC55
Size / Dimension 0.094Diax0.250L 2.39mmx6.35mm
Tolerance ±1%
Feature Military, Moisture Resistant, Weldable
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
Temperature Coefficient±50ppm/°C
Resistance 2.05kOhms
Max Operating Temperature175°C
Min Operating Temperature -65°C
Composition Metal Film
Power (Watts) 0.125W 1/8W
Military Standard MIL-PRF-55182
Failure RateR (0.01%)
Diameter 2.39mm
Length 7.62mm
RoHS StatusNon-RoHS Compliant
In-Stock:8327 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.00000$1
500$0.99$495
1000$0.98$980
1500$0.97$1455
2000$0.96$1920
2500$0.95$2375

About RNC55H2051FRRE765

The RNC55H2051FRRE765 from Vishay Dale is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Metal Film 2.05K Ohm 1% 1/8W 50ppm/C 0.01% Conformal AXL Thru-Hole T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RNC55H2051FRRE765, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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