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M55342H08B13E0MWS

M55342H08B13E0MWS

M55342H08B13E0MWS

Vishay Dale

Res Thin Film 2010 13K Ohm 1% 4/5W 50ppm/C 1% Molded SMD SMD Waffle Pack

SOT-23

M55342H08B13E0MWS Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact PlatingLead, Tin
Package / Case 2010 (5025 Metric)
Supplier Device Package 2010
Operating Temperature-55°C~150°C
PackagingTray
Published 2016
Series Military, MIL-PRF-55342, RM2010
Size / Dimension 0.209Lx0.098W 5.31mmx2.49mm
Tolerance ±1%
Feature Military, Non-Inductive
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Temperature Coefficient±50ppm/°C
Resistance 13kOhms
Max Operating Temperature150°C
Min Operating Temperature -55°C
Composition Thin Film
Power (Watts) 0.8W
Max Power Dissipation800mW
Military Standard MIL-PRF-55342
Failure RateM (1%)
Height 838.2μm
Height Seated (Max) 0.033 0.84mm
Length 5.3086mm
Width 2.4892mm
Thickness 381μm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:585 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$5.73380$573.38

About M55342H08B13E0MWS

The M55342H08B13E0MWS from Vishay Dale is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thin Film 2010 13K Ohm 1% 4/5W 50ppm/C 1% Molded SMD SMD Waffle Pack.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the M55342H08B13E0MWS, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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