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IMC0603ER39NJ

IMC0603ER39NJ

IMC0603ER39NJ

Vishay Dale

Inductor High Frequency Chip Wirewound 39nH 5% 100MHz 30Q-Factor Ceramic 300mA 800mOhm DCR 0603 T/R

SOT-23

IMC0603ER39NJ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0603 (1608 Metric)
Number of Pins 2
Material - Core Ceramic
Operating Temperature-40°C~100°C
PackagingTape & Reel (TR)
Published 2016
Series IMC-0603
Size / Dimension 0.063Lx0.041W 1.60mmx1.05mm
Tolerance ±5%
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
HTS Code8504.50.80.00
Shielding Unshielded
Depth 950μm
Current Rating300mA
Military Standard Not
Case Code (Metric) 1608
Case Code (Imperial) 0603
Inductance 39nH
Test Frequency100MHz
DC Resistance (DCR) 800mOhm Max
Max DC Current 300mA
Frequency - Self Resonant 1.8GHz
Q @ Freq 30 @ 500MHz
Q Factor 30
Inductance Tolerance 5%
DC Current 300mA
Height 1mm
Height Seated (Max) 0.049 1.25mm
Radiation HardeningNo
REACH SVHC Unknown
RoHS StatusROHS3 Compliant
In-Stock:1154 items

About IMC0603ER39NJ

The IMC0603ER39NJ from Vishay Dale is a high-performance microcontroller designed for a wide range of embedded applications. This component features Inductor High Frequency Chip Wirewound 39nH 5% 100MHz 30Q-Factor Ceramic 300mA 800mOhm DCR 0603 T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the IMC0603ER39NJ, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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