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561R10TCCQ27

561R10TCCQ27

561R10TCCQ27

Vishay Cera-Mite

Ceramic Disc Capacitors 1Kvolts 27pF 5% .25LS NPO

SOT-23

561R10TCCQ27 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Contact PlatingTin
Mount PCB, Through Hole
Mounting Type Through Hole
Package / Case Radial, Disc
Number of Pins 2
Weight 4.535924g
Operating Temperature-55°C~105°C
PackagingBulk
Published 2007
Series Cera-Mite 561R
Size / Dimension 0.370Dia 9.40mm
Tolerance ±5%
Feature Low Dissipation Factor
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Radial
Temperature CoefficientC0G NP0
Max Operating Temperature105°C
Min Operating Temperature -55°C
Composition Ceramic
Applications General Purpose
Voltage - Rated 1000V 1kV
Capacitance 27pF
Voltage - Rated DC 1kV
Depth 4mm
Lead Pitch 6.4mm
Dielectric C0G
Lead Spacing0.252 6.40mm
Lead Diameter 510 μm
Lead Style Straight
Dissipation Factor0.1 %
Lead/Base Style Straight
Height 6.35mm
Height Seated (Max) 0.495 12.58mm
Length 50.8mm
Width 4mm
REACH SVHC Unknown
RoHS StatusROHS3 Compliant
In-Stock:7609 items

Pricing & Ordering

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About 561R10TCCQ27

The 561R10TCCQ27 from Vishay Cera-Mite is a high-performance microcontroller designed for a wide range of embedded applications. This component features Ceramic Disc Capacitors 1Kvolts 27pF 5% .25LS NPO.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 561R10TCCQ27, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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