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MBB0207IC5622DC100

MBB0207IC5622DC100

MBB0207IC5622DC100

Vishay

Through Hole 56.2 kΩ, Thin Film,

SOT-23

MBB0207IC5622DC100 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact PlatingTin
Mount Through Hole
Number of Terminals 2
Product Weight (g) 0.22
ECCN (US) EAR99
Resistance Value (Ohm) 56.2K
Maximum Voltage Rating (V) 350
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 155
Temperature Coefficient (ppm/°C) ±50
Temperature Range @ Derated Power (°C) 70 to 155
Fail Safe Fusible Resistor No
Flame-Proof Support No
Case Style Conformal Coated
Termination Forming Not Formed
Package Shape Cylindrical
Product Diameter (mm) 2.5
Lead Diameter (mm) 0.6
Lead Length (mm) 28
Mounting Through Hole
RoHS Compliant
PackagingAmmo
Tolerance 0.5%
Part StatusActive
Temperature Coefficient50 ppm/°C
Resistance 56.2 kΩ
Max Operating Temperature155 °C
Min Operating Temperature -55 °C
Composition Thin Film
Termination Style Axial
Power Rating (W) 0.6
Product Length (mm) 6.5
Length 6.5 mm
Diameter 2.5 mm
RoHS StatusRoHS Compliant
Radiation HardeningNo
Lead Free Lead Free
In-Stock:4350 items

About MBB0207IC5622DC100

The MBB0207IC5622DC100 from Vishay is a high-performance microcontroller designed for a wide range of embedded applications. This component features Through Hole 56.2 kΩ, Thin Film,.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MBB0207IC5622DC100, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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