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BCM6123TD1E2663T00

BCM6123TD1E2663T00

BCM6123TD1E2663T00

Vicor Corporation

BCM6123TD1E2663T00 datasheet pdf and DC DC Converters product details from Vicor Corporation stock available on our website

SOT-23

BCM6123TD1E2663T00 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mounting Type Through Hole
Package / Case 24-DIP Module
Operating Temperature-40°C~125°C
Series VI Chip® BCM®
Size / Dimension 2.40Lx0.99W x 0.28 H 61.0mmx25.1mmx7.2mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Bus Converter Module
Applications ITE (Commercial)
Power (Watts) 1600W
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Outputs 1
Efficiency 97.4%
Voltage - Isolation 4.242kV
Voltage - Input (Max) 410V
Voltage - Output 1 24V
Voltage - Input (Min) 260V
Current - Output (Max) 62.5A
RoHS StatusROHS3 Compliant
In-Stock:73 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$217.37000$217.37
10$210.35700$2103.57

About BCM6123TD1E2663T00

The BCM6123TD1E2663T00 from Vicor Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features BCM6123TD1E2663T00 datasheet pdf and DC DC Converters product details from Vicor Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BCM6123TD1E2663T00, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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