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EKZN630ELL390MF11D

EKZN630ELL390MF11D

EKZN630ELL390MF11D

United Chemi-Con

Aluminum Electrolytic Capacitors - Leaded 63V 39uF 20% Tol.

SOT-23

EKZN630ELL390MF11D Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-40°C~105°C
PackagingBulk
Published 2013
Series KZN
Size / Dimension 0.248Dia 6.30mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
Applications General Purpose
Capacitance 39μF
Voltage - Rated DC 63V
Lead Pitch 2.4892mm
Lead Spacing0.098 2.50mm
Lifetime @ Temp 6000 Hrs @ 105°C
Ripple Current420mA
Polarization Polar
Life (Hours) 6000 hours
Impedance240mOhm
Ripple Current @ Low Frequency 168mA @ 120Hz
Ripple Current @ High Frequency 420mA @ 100kHz
Lead/Base Style Straight
Diameter 6.3mm
Height 6.3mm
Height Seated (Max) 0.492 12.50mm
RoHS StatusROHS3 Compliant
In-Stock:12687 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.31000$0.31
10$0.21200$2.12
100$0.12750$12.75
500$0.09560$47.8

About EKZN630ELL390MF11D

The EKZN630ELL390MF11D from United Chemi-Con is a high-performance microcontroller designed for a wide range of embedded applications. This component features Aluminum Electrolytic Capacitors - Leaded 63V 39uF 20% Tol..

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EKZN630ELL390MF11D, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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