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EKMG6R3ELL472MK20S

EKMG6R3ELL472MK20S

EKMG6R3ELL472MK20S

United Chemi-Con

CAP ALUM 4700UF 20% 6.3V RADIAL

SOT-23

EKMG6R3ELL472MK20S Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Dielectric MaterialAluminium
Weight 4.535924g
Operating Temperature-55°C~105°C
PackagingBulk
Published 2010
Series KMG
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
Feature General Purpose
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Radial
Applications General Purpose
Capacitance 4700μF
Voltage - Rated DC 6.3V
Lead Pitch 5mm
Lead Spacing0.197 5.00mm
Lead Diameter 600 μm
Lifetime @ Temp 1000 Hrs @ 105°C
Ripple Current1.09A
Polarization Polar
Life (Hours) 1000 hours
Ripple Current @ Low Frequency 1.09A @ 120Hz
Ripple Current @ High Frequency 1.1772A @ 100kHz
Diameter 12.5mm
Height 20mm
Height Seated (Max) 0.846 21.50mm
Radiation HardeningNo
REACH SVHC Unknown
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:12910 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About EKMG6R3ELL472MK20S

The EKMG6R3ELL472MK20S from United Chemi-Con is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 4700UF 20% 6.3V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EKMG6R3ELL472MK20S, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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