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EKMG630ETD330MF11D

EKMG630ETD330MF11D

EKMG630ETD330MF11D

United Chemi-Con

Aluminum Electrolytic Capacitors - Leaded 33UF 63V SNB

SOT-23

EKMG630ETD330MF11D Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-55°C~105°C
PackagingCut Tape (CT)
Published 2011
Series KMG
Size / Dimension 0.248Dia 6.30mm
Tolerance ±20%
Pbfree Code yes
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
Applications General Purpose
Voltage - Rated 63V
Capacitance 33μF
Lead Pitch 2.5mm
Lead Spacing0.098 2.50mm
Lifetime @ Temp 1000 Hrs @ 105°C
Ripple Current100mA
Polarization Polar
Life (Hours) 1000 hours
Ripple Current @ Low Frequency 100mA @ 120Hz
Ripple Current @ High Frequency 180mA @ 100kHz
Dissipation Factor0.1 %
Height Seated (Max) 0.492 12.50mm
RoHS StatusROHS3 Compliant
In-Stock:56592 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.250160$0.25016
10$0.236000$2.36
100$0.222641$22.2641
500$0.210039$105.0195
1000$0.198150$198.15

About EKMG630ETD330MF11D

The EKMG630ETD330MF11D from United Chemi-Con is a high-performance microcontroller designed for a wide range of embedded applications. This component features Aluminum Electrolytic Capacitors - Leaded 33UF 63V SNB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EKMG630ETD330MF11D, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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