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EGPA350ELL332ML40S

EGPA350ELL332ML40S

EGPA350ELL332ML40S

United Chemi-Con

Aluminum Electrolytic Capacitors - Leaded 35Volts 3300uF

SOT-23

EGPA350ELL332ML40S Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Number of Pins 40
Operating Temperature-40°C~125°C
PackagingBulk
Published 2012
Series GPA
Size / Dimension 0.630Dia 16.00mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
Applications Automotive
Capacitance 3300μF
Lead Pitch 7.5mm
ESR (Equivalent Series Resistance) 17mOhm @ 100kHz
Lead Diameter 800 μm
Voltage 35V
Lifetime @ Temp 5000 Hrs @ 125°C
Leakage Current 4μA
Ripple Current3.97A
Polarization Polar
Life (Hours) 5000 hours
Ripple Current @ Low Frequency 2.9775A @ 120Hz
Ripple Current @ High Frequency 3.97A @ 100kHz
Diameter 16mm
Height Seated (Max) 1.634 41.50mm
RoHS StatusRoHS Compliant
Ratings AEC-Q200
In-Stock:3452 items

Pricing & Ordering

QuantityUnit PriceExt. Price
250$1.64808$412.02

About EGPA350ELL332ML40S

The EGPA350ELL332ML40S from United Chemi-Con is a high-performance microcontroller designed for a wide range of embedded applications. This component features Aluminum Electrolytic Capacitors - Leaded 35Volts 3300uF.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EGPA350ELL332ML40S, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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