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EGPA250ELL222MK30S

EGPA250ELL222MK30S

EGPA250ELL222MK30S

United Chemi-Con

CAP ALUM 2200UF 20% 25V RADIAL

SOT-23

EGPA250ELL222MK30S Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-40°C~125°C
PackagingBulk
Published 2012
Series GPA
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
Applications Automotive
Capacitance 2200μF
Voltage - Rated DC 25V
Lead Pitch 5mm
ESR (Equivalent Series Resistance) 29mOhm @ 100kHz
Lead Spacing0.197 5.00mm
Lead Diameter 600 μm
Lifetime @ Temp 5000 Hrs @ 125°C
Ripple Current2.56A
Polarization Polar
Life (Hours) 5000 hours
Ripple Current @ Low Frequency 1.92A @ 120Hz
Ripple Current @ High Frequency 2.56A @ 100kHz
Height Seated (Max) 1.240 31.50mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
Ratings AEC-Q200
In-Stock:2784 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.82000$1.82
10$1.43700$14.37
100$1.07800$107.8
500$0.81448$407.24

About EGPA250ELL222MK30S

The EGPA250ELL222MK30S from United Chemi-Con is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 2200UF 20% 25V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EGPA250ELL222MK30S, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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