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OPB608C

OPB608C

OPB608C

TT Electronics/Optek Technology

SENSR OPTO TRANS 1.27MM REFL PCB

SOT-23

OPB608C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case PCB Mount
Number of Pins 4
Operating Temperature-40°C~85°C
PackagingBulk
Published 2007
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Output Type Phototransistor
Operating Supply Voltage1.7V
Number of Elements 1
Power Dissipation100mW
Forward Current20mA
Forward Voltage1.7V
Collector Emitter Voltage (VCEO) 30V
Max Collector Current 25mA
Sensing Distance0.050 (1.27mm)
Collector Emitter Breakdown Voltage30V
Voltage - Collector Emitter Breakdown (Max) 30V
Current - Collector (Ic) (Max) 25mA
Reverse Breakdown Voltage 2V
Reverse Voltage2V
Wavelength 890 nm
Sensing Method Reflective
Max Breakdown Voltage 30V
Current - DC Forward (If) (Max) 50mA
RoHS StatusRoHS Compliant
In-Stock:6464 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.53000$1.53
100$1.47000$147
250$1.41000$352.5
500$1.36000$680

About OPB608C

The OPB608C from TT Electronics/Optek Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features SENSR OPTO TRANS 1.27MM REFL PCB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the OPB608C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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